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Product & technology
Packaging substrate
of semiconductor chip packaging uses high-precision circuits to provide signal connection and heat dissipation protection for the chip.
FCBGA
SiP
Memory
FCCSP
WBCSP
MEMS
solution integrator
Push forward continuous innovation, assist customers to build a more application-rich ecology
Memory
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RF
Microphone
Sensor
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GTS Shines at SEMICON CHINA 2025
GTS Shines at Two Major International Semiconductor Expos: SEMICON Taiwan & KPCA
About GTS
Product and technology
News dynamics
ESG
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